UPD4713A

UPD4713A


Specifications
SKU
12616515
Details

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Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage Vcc Operating 4.5 - 5.5 V
Supply Current ICC Operating, No Load - 20 - mA
Output High Level VOH IO = -100 μA 2.4 - Vcc-0.5 V
Output Low Level VOL IO = 16 mA 0 - 0.4 V
Input High Level VIH 2.0 - Vcc-0.5 V
Input Low Level VIL 0 - 0.8 V
Propagation Delay Time tpd Vcc = 5V, T = 25°C - 12 - ns
Power Dissipation PD Maximum - - 500 mW
Operating Temperature Topr -40 - 85 °C
Storage Temperature Tstg -65 - 150 °C

Instructions for Use:

  1. Supply Voltage:

    • Ensure the supply voltage (Vcc) is within the range of 4.5V to 5.5V.
    • Use a stable power source to avoid voltage fluctuations that can affect performance.
  2. Supply Current:

    • The typical supply current (ICC) is 20mA under no load conditions. Ensure your power supply can provide this current.
  3. Output Levels:

    • When the output is high (VOH), it should be at least 2.4V or up to Vcc - 0.5V.
    • When the output is low (VOL), it should be no more than 0.4V when sourcing 16mA.
  4. Input Levels:

    • For the input to be recognized as high (VIH), it must be at least 2.0V or up to Vcc - 0.5V.
    • For the input to be recognized as low (VIL), it must be no more than 0.8V.
  5. Propagation Delay:

    • The propagation delay time (tpd) is typically 12ns at Vcc = 5V and T = 25°C. This is the time it takes for the output to change state after the input changes.
  6. Power Dissipation:

    • The maximum power dissipation (PD) is 500mW. Ensure adequate heat sinking if operating near this limit.
  7. Operating Temperature:

    • The device is designed to operate within the temperature range of -40°C to 85°C. Avoid exposing the device to temperatures outside this range.
  8. Storage Temperature:

    • Store the device in an environment where the temperature ranges from -65°C to 150°C to ensure long-term reliability.
  9. Handling:

    • Handle the device with care to avoid static damage. Use proper ESD protection measures.
  10. Mounting:

    • Ensure proper mounting on the PCB to avoid mechanical stress on the pins and the device itself.
  11. Testing:

    • Test the device under the specified conditions to ensure it meets the required performance parameters.
(For reference only)

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