Details

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BUY VS-36MT80 https://www.utsource.net/itm/p/12616734.html

Parameter	Description	Value
Part Number	Device Identifier	VS-36MT80
Type	Device Type	MOSFET
Package	Encapsulation Style	TO-220
Drain-Source Voltage (Vds)	Maximum Voltage Across Drain and Source	80V
Gate-Source Voltage (Vgs)	Maximum Voltage Across Gate and Source	±20V
Continuous Drain Current (Id)	Continuous Current Through Drain	36A
Pulse Drain Current (Ipsm)	Peak Pulse Current Through Drain	180A
Power Dissipation (Ptot)	Maximum Power Dissipation	150W
Rds(on) at Vgs=10V	On-State Resistance	4.5mΩ
Gate Charge (Qg)	Total Gate Charge	95nC
Input Capacitance (Ciss)	Input Capacitance	1500pF
Output Capacitance (Coss)	Output Capacitance	250pF
Reverse Transfer Capacitance (Crss)	Reverse Transfer Capacitance	220pF
Operating Temperature (Tj)	Junction Temperature Range	-55°C to 150°C
Storage Temperature (Tstg)	Storage Temperature Range	-65°C to 150°C

Instructions for Use:

1. Handling Precautions:

   • Handle the device with care to avoid mechanical damage.
   • Use appropriate ESD protection to prevent damage from static electricity.

2. Mounting:

   • Ensure proper heat sinking to maintain the junction temperature within the specified range.
   • Use a thermal compound between the device and the heatsink for better thermal conductivity.

3. Electrical Connections:

   • Connect the drain, source, and gate terminals correctly according to the circuit diagram.
   • Use short leads to minimize parasitic inductance and capacitance.

4. Operating Conditions:

   • Do not exceed the maximum ratings for Vds, Vgs, Id, Ipsm, and Ptot.
   • Ensure the operating temperature is within the specified range to avoid thermal runaway.

5. Testing:

   • Before final assembly, test the device under controlled conditions to ensure it meets the required specifications.
   • Use a suitable power supply and load to simulate real-world operating conditions.

6. Storage:

   • Store the device in a dry, cool place away from direct sunlight and sources of heat.
   • Keep the device in its original packaging until ready for use to protect against environmental factors.

7. Soldering:

   • Use a soldering iron with a temperature control to avoid overheating the device.
   • Follow the recommended soldering profile to ensure a reliable connection without damaging the device.

8. Troubleshooting:

   • If the device fails to operate correctly, check for proper connections, correct polarity, and any signs of physical damage.
   • Refer to the datasheet for detailed troubleshooting steps and contact the manufacturer for further assistance if needed.

(For reference only)