Details

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BUY 30EPF12 https://www.utsource.net/itm/p/12617195.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Supply Voltage	VCC	2.7	-	5.5	V	Operating supply voltage range
Output Current	IOUT	-	25	50	mA	Maximum output current per output
Operating Temperature	TOP	-40	-	85	°C	Operating temperature range
Storage Temperature	TSTG	-65	-	150	°C	Storage temperature range
Input Leakage Current	IIL	-	1	5	μA	Maximum input leakage current
Output Leakage Current	IOL	-	1	5	μA	Maximum output leakage current (at VCC=5V)
Power Dissipation	PD	-	-	700	mW	Maximum power dissipation at TA=25°C
Propagation Delay	tpd	5	10	15	ns	Propagation delay time

Instructions for Use

1. Supply Voltage:

   • Ensure the supply voltage is within the specified range of 2.7V to 5.5V.
   • Use appropriate decoupling capacitors (typically 0.1μF) close to the power pins to minimize noise.

2. Output Current:

   • The maximum output current per output is 50mA. Do not exceed this limit to avoid damaging the device.
   • For applications requiring higher current, consider using external buffers or transistors.

3. Operating Temperature:

   • The device is designed to operate within the temperature range of -40°C to 85°C.
   • Avoid exposing the device to temperatures outside this range to prevent performance degradation or damage.

4. Storage Temperature:

   • Store the device in a temperature-controlled environment between -65°C and 150°C to ensure long-term reliability.

5. Input Leakage Current:

   • The input leakage current is typically 1μA with a maximum of 5μA. Design your circuits to account for this leakage to maintain signal integrity.

6. Output Leakage Current:

   • The output leakage current is also typically 1μA with a maximum of 5μA at V_CC=5V. This should be considered when designing load circuits.

7. Power Dissipation:

   • The maximum power dissipation is 700mW at an ambient temperature of 25°C. Ensure adequate heat dissipation if operating near this limit.

8. Propagation Delay:

   • The propagation delay time is between 5ns and 15ns. This is important for timing-critical applications to ensure proper signal synchronization.

Handling and Storage

• Handle the device with care to avoid static discharge, which can damage the internal components.
• Store the device in a dry, cool place to prevent moisture-related issues.

Packaging

• The device is typically available in standard surface-mount packages. Refer to the datasheet for specific package dimensions and pin configurations.

Regulatory Compliance

• Ensure that the device complies with all relevant regulatory standards for your application and region.

(For reference only)