Details
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| Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Forward Voltage | VF | - | 1.2 | 1.5 | V | IF = 5 mA |
| Reverse Current | IR | - | - | 0.1 | 渭A | VR = 5 V |
| Peak Forward Current | IF(surge) | - | - | 30 | mA | tp = 10 ms |
| Continuous Forward Current | IF | - | - | 20 | mA | TA = 25掳C |
| Reverse Breakdown Voltage | VR | - | - | 5.0 | V | IR = 1 渭A |
| Operating Temperature Range | TOP | -40 | - | 85 | 掳C | - |
| Storage Temperature Range | TSTG | -55 | - | 150 | 掳C | - |
Instructions for Use:
Forward Voltage (VF):
- Ensure that the forward voltage across the photodiode does not exceed 1.5V when the forward current is 5mA.
Reverse Current (IR):
- The reverse current should be kept below 0.1渭A when the reverse voltage is 5V to avoid damage.
Peak Forward Current (IF(surge)):
- The peak forward current should not exceed 30mA for pulse durations of up to 10ms.
Continuous Forward Current (IF):
- The continuous forward current should not exceed 20mA at ambient temperatures of 25掳C to ensure reliable operation.
Reverse Breakdown Voltage (VR):
- The reverse breakdown voltage should not exceed 5.0V to prevent damage to the device.
Operating Temperature Range (TOP):
- The device can operate reliably within the temperature range of -40掳C to 85掳C.
Storage Temperature Range (TSTG):
- Store the device in an environment with temperatures ranging from -55掳C to 150掳C to maintain its performance.
Handling Precautions:
- Handle the PC812 with care to avoid static discharge and physical damage.
- Ensure that all connections are secure and free from corrosion or oxidation.
Mounting:
- Follow the recommended soldering profile to avoid thermal stress.
- Ensure proper alignment and orientation during assembly.
Testing:
- Use appropriate test equipment and methods to verify the parameters and functionality of the PC812.
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