Details

---

BUY HEF4517BP https://www.utsource.net/itm/p/12617534.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	Operating	3	-	18	V
Input Voltage (High)	VIH	-	2	-	VCC	V
Input Voltage (Low)	VIL	-	0	-	0.8	V
Output Voltage (High)	VOH	IO = -1 mA	-	VCC - 0.5	VCC - 0.1	V
Output Voltage (Low)	VOL	IO = 1 mA	0	0.1	0.5	V
Input Current (High)	IIH	-	-	1	20	渭A
Input Current (Low)	IIL	-	-1	-	-20	渭A
Output Current (Source)	IOH	VO = VCC - 1.5V	-	4	6	mA
Output Current (Sink)	IOL	VO = 0.4V	-	10	16	mA
Propagation Delay Time	tpd	VCC = 10V, fL = 1 kHz	-	50	100	ns
Power Dissipation	PD	-	-	-	100	mW

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the range of 3V to 18V.
   • Connect V_CC to the positive supply and GND to the ground.

2. Input Signals:

   • For a high input signal, ensure the voltage (V_IH) is at least 2V but can go up to V_CC.
   • For a low input signal, ensure the voltage (V_IL) is between 0V and 0.8V.
   • The input current (I_IH and I_IL) should be within the specified limits to avoid damage.

3. Output Signals:

   • When the output is high, the voltage (V_OH) will be between V_CC - 0.5V and V_CC - 0.1V.
   • When the output is low, the voltage (V_OL) will be between 0V and 0.5V.
   • The output current (I_OH and I_OL) should be within the specified limits to avoid damage.

4. Propagation Delay:

   • The propagation delay time (t_pd) is the time it takes for the output to change state after the input changes. It is typically between 50ns and 100ns at V_CC = 10V.

5. Power Dissipation:

   • The maximum power dissipation (P_D) is 100mW. Ensure that the device does not exceed this limit to prevent overheating and potential failure.

6. Handling:

   • Handle the HEF4517BP with care to avoid static discharge, which can damage the device.
   • Store the device in a dry, cool place away from direct sunlight.

7. Mounting:

   • Ensure proper mounting on the PCB to maintain good electrical connections and thermal dissipation.
   • Follow the recommended soldering profile to avoid thermal stress during assembly.

(For reference only)