Details

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BUY SUD50P04-23 https://www.utsource.net/itm/p/12618236.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Input Voltage	VIN	2.7	-	5.5	V
Output Voltage	VOUT	-	4.2	-	V	Fixed output
Output Current	IOUT	-	50	-	mA	Continuous
Efficiency	η	-	90	-	%	At nominal conditions
Dropout Voltage	VDROPOUT	-	23	-	mV	At IOUT = 50mA
Quiescent Current	IQ	-	10	-	μA	No load
Load Regulation	-	-	1	-	%	From 0 to 50mA
Line Regulation	-	-	0.1	-	%/V	From 2.7V to 5.5V
Operating Temperature	TJ	-40	-	85	°C	Junction temperature
Storage Temperature	TSTG	-65	-	150	°C

Instructions for Use:

1. Input Voltage (VIN): Ensure the input voltage is within the range of 2.7V to 5.5V to avoid damage or improper operation.
2. Output Voltage (VOUT): The output voltage is fixed at 4.2V. No external components are required to set this voltage.
3. Output Current (IOUT): The device can provide a continuous output current of up to 50mA. Exceeding this limit may cause overheating or damage.
4. Efficiency: The typical efficiency is 90% under nominal conditions. Monitor the operating conditions to ensure optimal performance.
5. Dropout Voltage (VDROPOUT): The dropout voltage is 23mV at an output current of 50mA. This is the minimum difference between VIN and VOUT for proper regulation.
6. Quiescent Current (IQ): The quiescent current is 10μA with no load, contributing minimally to power consumption.
7. Load Regulation: The load regulation is 1%, meaning the output voltage will vary by 1% from no load to full load.
8. Line Regulation: The line regulation is 0.1%/V, indicating the output voltage will change by 0.1% for each volt change in input voltage.
9. Operating Temperature (TJ): The device operates safely within a junction temperature range of -40°C to 85°C. Ensure adequate heat dissipation if operating near the upper limit.
10. Storage Temperature (TSTG): Store the device in an environment with temperatures ranging from -65°C to 150°C.

Additional Notes:

• PCB Layout: Ensure proper PCB layout to minimize noise and parasitic effects. Use short leads and place bypass capacitors close to the input and output pins.
• Thermal Management: If operating at high temperatures or high currents, consider adding a heatsink or using a larger copper area on the PCB for better thermal dissipation.
• Capacitors: While not required for stability, adding a 1μF ceramic capacitor on the input and a 1μF ceramic capacitor on the output can improve transient response and reduce ripple.

(For reference only)