Details
BUY OBGZ32AP https://www.utsource.net/itm/p/12618251.html
Parameter | Description | Value | Unit |
---|---|---|---|
Supply Voltage | Operating voltage range | 2.7 to 5.5 | V |
Output Current | Maximum output current | 300 | mA |
Operating Temp. | Temperature range for operation | -40 to 85 | °C |
Package Type | Type of package | SOIC-8 | - |
Quiescent Current | Current consumption in standby mode | 1.5 | μA |
Load Regulation | Change in output voltage with varying load | ±1 | % |
Line Regulation | Change in output voltage with varying input | ±0.5 | % |
Dropout Voltage | Minimum difference between input and output | 0.3 | V |
Instructions for Use:
- Power Supply Connection: Connect the supply voltage within the specified range (2.7V to 5.5V) to the Vin pin.
- Output Connection: Ensure that the load does not exceed the maximum output current of 300mA. Connect the load to the Vout pin.
- Grounding: Properly connect the ground (GND) to ensure stable operation.
- Thermal Considerations: The device is designed to operate within a temperature range of -40°C to 85°C. Ensure adequate heat dissipation if operating near the upper limit.
- Bypass Capacitors: For optimal performance, place a 1μF capacitor between Vin and GND and another between Vout and GND as close to the device as possible.
- Stability: The OBGZ32AP is internally compensated and stable with capacitive loads. However, avoid using capacitors larger than 10μF on the output without checking stability.
- Handling: Handle with care to prevent damage from electrostatic discharge (ESD). Follow standard ESD precautions when handling the component.
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