Details
BUY IXTL2N450 https://www.utsource.net/itm/p/12620592.html
| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | - | - | 450 | V | Maximum drain-to-source voltage |
| Gate-Source Voltage | VGS | -10 | - | 15 | V | Maximum gate-to-source voltage |
| Continuous Drain Current | ID | - | - | 2 | A | Continuous drain current at Tc=25掳C |
| Pulse Drain Current | IDM | - | - | 8 | A | Pulse drain current |
| Gate Charge | Qg | - | 30 | - | nC | Total gate charge |
| Input Capacitance | Ciss | - | 1600 | - | pF | Input capacitance |
| Output Capacitance | Coff | - | 220 | - | pF | Output capacitance |
| Reverse Transfer Capacitance | Crss | - | 260 | - | pF | Reverse transfer capacitance |
| RDS(on) at VGS=10V | RDS(on) | - | 0.5 | - | 惟 | On-resistance |
Instructions:
- Handling and Storage: Store in a dry, cool place. Avoid exposure to high humidity or extreme temperatures.
- Mounting: Ensure proper heat sinking for applications where the device will operate near its maximum ratings.
- Electrical Connections: Connect the gate with a low-inductance path to minimize noise and ensure stable operation.
- Gate Drive: Apply gate voltages within the specified limits to prevent damage to the gate oxide.
- Pulse Operation: For pulse operation, refer to the IDM (pulse drain current) rating and ensure that the duty cycle does not exceed recommended levels.
- Thermal Considerations: Monitor the junction temperature to stay within safe operating limits. Use appropriate thermal management techniques if necessary.
- ESD Protection: Handle with care to avoid electrostatic discharge damage. Use ESD-safe tools and workstations.
Note: Always consult the latest datasheet from the manufacturer for the most accurate and up-to-date information.
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