Details
BUY TD142N16KOF https://www.utsource.net/itm/p/200722.html
SCR / Diode Modules up to 1800V SCR / Diode Phase Control
Parameter | Symbol | Min | Typ | Max | Unit | Description |
---|---|---|---|---|---|---|
Supply Voltage | VDD | 12 | 24 | V | Operating supply voltage range | |
Output Current | IO | 1.6 | A | Continuous output current | ||
Peak Output Current | IOPK | 3.2 | A | Peak output current | ||
Quiescent Current | IQ | 10 | 30 | mA | Quiescent current at no load | |
Dropout Voltage | VDROPOUT | 1.0 | 1.5 | V | Dropout voltage at full load | |
PSRR (10 Hz to 100 kHz) | PSRR | 60 | 75 | dB | Power supply rejection ratio | |
Junction Temperature | Tj | -40 | 125 | °C | Operating junction temperature range | |
Storage Temperature | Tstg | -40 | 150 | °C | Storage temperature range |
Instructions for TD142N16KOF
Power Supply Connection:
- Connect the positive terminal of the power supply to the VDD pin and the negative terminal to the GND pin.
Output Configuration:
- Ensure that the load is connected between the VOUT pin and the GND pin. The maximum continuous output current should not exceed 1.6A.
Thermal Considerations:
- The device can operate within a junction temperature range of -40°C to 125°C. For high current applications, ensure adequate heat sinking to maintain the junction temperature within limits.
Capacitor Requirements:
- Place an input capacitor (typically 0.1 μF) close to the VDD pin to filter out noise and provide transient response.
- An output capacitor (typically 10 μF) is recommended to stabilize the output voltage and reduce ripple.
PCB Layout:
- Keep the PCB traces from VDD to the IC as short as possible to minimize inductance and improve transient response.
- Ensure proper grounding and avoid long ground loops which can introduce noise.
Handling Precautions:
- Handle the device with care to avoid damage due to electrostatic discharge (ESD). Use appropriate ESD protection equipment.
- Do not exceed the maximum ratings specified in the parameter table to prevent damage to the device.
Testing:
- Before deploying the device in a final application, thoroughly test it under all expected operating conditions to ensure reliable performance.
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