Details
BUY SN74BCT244DW https://www.utsource.net/itm/p/566397.html
OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS
| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Supply Voltage | VCC | Operating | 2.0 | 5.5 | V | |
| Input Low Voltage | VIL | VIN = 0.8V, TA = 25掳C | 0.8 | V | ||
| Input High Voltage | VIH | VIN = 2.0V, TA = 25掳C | 2.0 | V | ||
| Output Low Voltage | VOL | IO = 16mA, TA = 25掳C | 0.1 | 0.4 | V | |
| Output High Voltage | VOH | IO = -4mA, TA = 25掳C | 2.4 | 5.0 | V | |
| Propagation Delay Time | tpd | VCC = 5V, TA = 25掳C | 7 | ns | ||
| Power Dissipation | PD | Per Buffer, VCC = 5V | 130 | mW | ||
| Operating Temperature Range | TJ | -40 | 85 | 掳C |
Instructions for SN74BCT244DW:
Power Supply Connection:
- Connect the VCC pin to a power supply within the range of 2.0V to 5.5V.
- Ensure the GND pin is properly grounded.
Input Signal Handling:
- Apply input signals that comply with the specified input voltage levels (VIL and VIH).
- Avoid exceeding the maximum input voltage to prevent damage.
Output Load Management:
- Ensure the output load current does not exceed the maximum ratings for VOL and VOH.
- Consider the propagation delay when designing timing-sensitive circuits.
Operating Temperature:
- Operate the device within the temperature range of -40掳C to 85掳C to ensure reliable performance.
Handling Electrostatic Discharge (ESD):
- Handle the device with care to avoid ESD damage.
- Use appropriate ESD protection measures during assembly and handling.
Mounting and PCB Design:
- Follow standard PCB design guidelines for signal integrity and thermal management.
- Ensure proper spacing and grounding to minimize noise and interference.
Storage and Packaging:
- Store in a dry environment and follow recommended storage conditions.
- Use anti-static packaging when storing or transporting the device.
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