Details
BUY SI4542DY https://www.utsource.net/itm/p/810884.html
MOSFET, SI4542, DUAL COMPLEMENTARY, SOIC-8
| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Supply Voltage | VDD | Operating | 2.0 | 5.5 | V | |
| Operating Temperature | Toper | -40 | 85 | 掳C | ||
| Storage Temperature | Tstg | -65 | 150 | 掳C | ||
| Output Current per Channel | IOUT | Continuous, per channel | 300 | mA | ||
| Total Output Current | ITOT | All channels on | 1.2 | A | ||
| Power Dissipation | PD | TJ = 25掳C | 1.0 | W | ||
| Junction Temperature | TJ | Absolute Maximum | 150 | 掳C |
Instructions for SI4542DY
Power Supply Requirements:
- Ensure the supply voltage (VDD) is within the range of 2.0V to 5.5V.
- Use appropriate decoupling capacitors close to the power pins to maintain stability.
Temperature Considerations:
- The device can operate in temperatures ranging from -40掳C to 85掳C.
- Store the device in temperatures between -65掳C and 150掳C.
Current Handling:
- Each channel can handle up to 300mA continuously.
- When all channels are active, ensure the total current does not exceed 1.2A.
Thermal Management:
- Monitor the junction temperature to not exceed 150掳C.
- Keep the power dissipation under 1.0W at a junction temperature of 25掳C to avoid overheating.
Installation and Handling:
- Follow proper ESD precautions during handling.
- Ensure correct orientation and pin alignment when mounting on the PCB.
Note: For detailed specifications and application notes, refer to the official datasheet provided by the manufacturer.
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