Details
BUY IRFI530NPBF https://www.utsource.net/itm/p/830426.html
HEXFET㈢ Power MOSFET
| Parameter | Symbol | Test Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | V(DSS) | 100 | V | |||
| Gate-Source Voltage | V(GSS) | -15 | 15 | V | ||
| Continuous Drain Current | I(D) | Tc = 25°C | 9.0 | A | ||
| Tc = 75°C | 6.4 | A | ||||
| Pulse Drain Current | I(DM) | Tc = 25°C, tp = 10ms | 36 | A | ||
| Power Dissipation | P(TOT) | Tc = 25°C | 80 | W | ||
| Junction Temperature | T(J) | -55 | 150 | °C | ||
| Total Gate Charge | Q(G) | VGS = ±15V | 45 | nC |
Instructions for IRFI530NPBF:
Handling and Storage:
- Store in a dry, cool place.
- Handle with care to avoid damage to the leads or body.
Mounting:
- Ensure proper heat sinking if operating at high current levels.
- Use appropriate mounting hardware to secure the device.
Electrical Connections:
- Verify all connections are correct before applying power.
- Avoid exceeding the maximum ratings listed in the table.
Operation:
- Operate within specified temperature ranges to ensure reliability.
- Do not exceed the maximum drain-source voltage or gate-source voltage to prevent damage.
Testing:
- When testing, use pulse testing methods where applicable to avoid overheating.
- Follow safety protocols when handling high voltages and currents.
Application Notes:
- Refer to the manufacturer's application notes for detailed design considerations and circuit recommendations.
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