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BUY SN74HC574DWR https://www.utsource.net/itm/p/839097.html
Quad EIA-485 Line Driver with Three-State Output; Package: SOIC-20 WB; No of Pins: 20; Container: Tape and Reel; Qty per Container: 1000
Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
---|---|---|---|---|---|---|
Supply Voltage | VCC | 2.0 | 6.0 | V | ||
Output High Level Voltage | VOH | IO = -1 mA | 2.4 | VCC | V | |
Output Low Level Voltage | VOL | IO = 1 mA | 0 | 0.4 | V | |
Input Leakage Current | IIH | VI = VCC | -1 | 1 | μA | |
Input Leakage Current | IIL | VI = 0 V | -1 | 1 | μA | |
Propagation Delay Time | tpd | VCC = 4.5 V, TA = 25°C | 8 | ns | ||
Power Dissipation | PD | 100 | mW |
Instructions for SN74HC574DWR
Supply Voltage (VCC):
- Operate within the specified voltage range of 2.0 to 6.0 V to ensure reliable operation.
Output Levels:
- Ensure that the output voltages remain within the specified limits under all operating conditions. The high-level output should not exceed VCC and should be at least 2.4V when sourcing current.
- The low-level output should not exceed 0.4V when sinking current.
Input Currents:
- Keep input currents within the leakage current specifications (-1μA to 1μA) to prevent damage or unreliable behavior.
Propagation Delay (tpd):
- Account for a typical propagation delay of 8ns at VCC = 4.5V and ambient temperature (TA) = 25°C in timing designs.
Power Dissipation:
- Do not exceed the maximum power dissipation of 100mW to avoid overheating and potential failure.
Handling:
- Handle with care to avoid electrostatic discharge (ESD) damage. Use appropriate ESD protection measures during handling and installation.
Mounting:
- Ensure proper mounting on a PCB with adequate heat dissipation if operating near the upper limit of power dissipation.
Storage:
- Store in a dry environment and follow manufacturer guidelines for long-term storage to maintain component integrity.
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