OP213FSZ
Category: Elec-componentLinear - Amplifiers - Instrumentation, OP Amps, Buffer AmpsIntegrated CircuitAmplifiers - Instrumentation, OP Amps, Buffer Amps
Specifications
SKU
844456
Details
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Low Noise, Low Drift Single-Supply Operational Amplifiers Dual; Package: SOIC; No of Pins: 8; Temperature Range: Industrial
| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Supply Voltage | Vcc | Operating | 2.7 | - | 5.5 | V |
| Input Offset Voltage | Vos | Vcm = 0 to Vcc - 1V | -0.5 | 0 | +0.5 | mV |
| Input Bias Current | Ib | Vcm = 0 to Vcc - 1V | -1 | 0 | +1 | nA |
| Slew Rate | SR | Vout = 0 to Vcc | 0.5 | - | 1.0 | V/渭s |
| Bandwidth | BW | Vpp = 2V, G = +1 | 1.0 | - | 1.5 | MHz |
| Output Current | Iout | Short Circuit | - | 20 | - | mA |
| Quiescent Current | IQ | All Outputs Off | 100 | 200 | 300 | 渭A |
Instructions for Use:
Power Supply:
- Ensure the supply voltage is within the range of 2.7V to 5.5V for optimal performance.
Input Signals:
- Keep input signals within the common-mode voltage range (0 to Vcc - 1V) to avoid distortion and potential damage.
Biasing:
- Be aware of the input bias current which can vary from -1nA to +1nA. Proper biasing networks may be necessary depending on the application.
Slew Rate Consideration:
- The device has a typical slew rate of up to 1.0V/渭s. Design your circuit considering this limitation to prevent signal distortion at higher frequencies.
Frequency Response:
- The bandwidth is typically between 1.0MHz and 1.5MHz with a gain of +1. Adjust your expectations for high-frequency applications accordingly.
Output Drive Capability:
- The output can source or sink up to 20mA in short-circuit conditions. Ensure that the load does not exceed this limit.
Power Consumption:
- The quiescent current ranges from 100渭A to 300渭A. This should be considered in low-power designs.
Handling:
- Handle with care as ESD (Electrostatic Discharge) sensitive components can be damaged by improper handling. Use appropriate anti-static measures.
Mounting:
- Follow manufacturer guidelines for mounting to ensure proper thermal management and mechanical stability.
Testing:
- Verify all parameters under specified conditions before deploying the component in critical applications.
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