XC3S250E-4PQ208C

XC3S250E-4PQ208C

Category: IC Chips

Specifications
SKU
1327387
Details

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XC3S250E-4PQ208C
Parameter Description
Device XC3S250E-4PQ208C
Family Spartan-3E
Logic Cells 250
I/O Banks 15
Package PQFP (Plastic Quad Flat Pack) with 208 pins
Speed Grade -4 (Fastest speed grade available for this device)
Configuration Memory Internal, non-volatile Flash memory
JTAG Boundary Scan Yes
Operating Temperature Commercial: 0掳C to 70掳C
Supply Voltage Vcco = 1.8V, 2.5V, or 3.3V; Vccint = 1.2V
Clock Resources 4 Digital Clock Managers (DCMs)
Block RAM 128 Kbits
Multiplier Resources 4 18x18 multipliers
Configuration Mode Master, Slave, BPI (Byte-wide Parallel Interface), SPI, SelectMAP

Instructions for Use:

  1. Power Supply Requirements:

    • Ensure that the supply voltages (Vcco and Vccint) are within specified ranges.
    • Vcco can be set to 1.8V, 2.5V, or 3.3V depending on the I/O standards used.
    • Vccint must be set to 1.2V.
  2. Configuration:

    • The device can be configured using various modes such as Master, Slave, BPI, SPI, or SelectMAP.
    • For initial configuration, refer to the Xilinx Platform Cable USB manual for JTAG programming.
  3. Clock Management:

    • Utilize the DCMs for clock synthesis, phase shifting, and duty cycle correction.
    • Ensure proper setup and hold times for all clock signals.
  4. Operating Environment:

    • Operate within the commercial temperature range of 0掳C to 70掳C to ensure reliable performance.
    • Avoid exposing the device to extreme temperatures outside this range.
  5. Handling:

    • Handle with care to avoid ESD damage. Always use proper ESD protection measures.
    • Follow guidelines for soldering and PCB layout as detailed in Xilinx application notes.
  6. Testing and Debugging:

    • Use JTAG boundary scan for testing and debugging circuits.
    • Leverage Xilinx tools like iMPACT for configuration and ChipScope Pro for in-system debugging.
  7. Documentation:

    • Refer to the Spartan-3E data sheet and user guides for detailed information on design flows, timing analysis, and advanced features.
(For reference only)

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