Details
BUY LTV827C https://www.utsource.net/itm/p/1401112.html
HIgh Density Mounting Type Photocoupler
| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Forward Voltage | VF | IF = 20 mA | 1.1 | 1.3 | 1.5 | V |
| Reverse Current | IR | VR = 5 V | - | 10 | 100 | nA |
| Peak Forward Current | IFP | Pulse Width ≤ 1 ms | - | 100 | 150 | mA |
| Operating Temperature | TOPR | -40 | 85 | °C | ||
| Storage Temperature | TSTG | -55 | 150 | °C |
Instructions for LTV827C:
Handling and Storage:
- Store the device in a dry, cool place within the temperature range specified.
- Handle with care to avoid physical damage.
Mounting and Soldering:
- Ensure proper alignment during mounting to prevent short circuits.
- Use a soldering iron temperature not exceeding 300°C for no longer than 10 seconds per connection.
- Allow adequate cooling time post-soldering to prevent thermal shock.
Electrical Connections:
- Connect the device ensuring correct polarity; observe the forward voltage limits.
- Do not exceed the peak forward current rating during operation or testing.
- Keep reverse voltage within the specified limits to avoid damage.
Operational Guidelines:
- Operate within the specified operating temperature range to ensure reliability.
- For applications requiring high-frequency switching, consider thermal management solutions to maintain performance.
Testing and Troubleshooting:
- Regularly test the forward and reverse characteristics under typical operating conditions.
- If abnormal behavior is detected, check for overcurrent or overheating issues.
Environmental Considerations:
- The device is RoHS compliant, adhering to environmental standards.
- Dispose of any non-functional devices responsibly according to local regulations.
View more about LTV827C on main site
