Details

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BUY MPQ6426 https://www.utsource.net/itm/p/1432842.html

Parameter	Symbol	Test Conditions	Min	Typ	Max	Unit
Input Voltage	VIN	-	2.7	-	5.5	V
Output Voltage	VOUT	-	-	1.2	-	V
Quiescent Current	IQ	VIN = 3.3V, No Load	-	60	-	μA
Shutdown Current	ISD	VIN = 3.3V, SHDN = Low	-	0.1	-	μA
Load Regulation	ΔVOL	IOUT = 0mA to 200mA, VIN = 3.3V	-	50	-	mV
Line Regulation	ΔVOL	VIN = 2.7V to 5.5V, IOUT = 100mA	-	30	-	mV
Dropout Voltage	VDROPOUT	IOUT = 100mA	-	200	-	mV
Power Supply Rejection Ratio (PSRR)	PSRR	f = 1kHz, IOUT = 100mA	-	60	-	dB
Enable Time	tEN	VEN rises from 0V to 1.2V	-	80	-	μs
Disable Time	tDIS	VSHDN drops from 1.2V to 0V	-	80	-	μs

Instructions for MPQ6426:

1. Power Supply Connection:

   • Connect the input voltage (VIN) between 2.7V and 5.5V to the input pin.
   • Ensure proper bypassing with a 1μF ceramic capacitor placed close to the input pin.

2. Output Configuration:

   • The output voltage is internally set to 1.2V. For different output voltages, external resistors may be required depending on the specific application.

3. Enable/Shutdown Functionality:

   • Apply a logic high to the EN pin to enable the device.
   • Apply a logic low or leave the EN pin floating to put the device into shutdown mode, reducing power consumption.

4. Thermal Considerations:

   • Ensure adequate PCB layout for heat dissipation, especially under higher load conditions.
   • Use a thermal pad if necessary to improve thermal performance.

5. Bypass Capacitors:

   • Place a 1μF capacitor at the output to stabilize the output voltage.
   • Additional capacitors can be added based on the stability requirements of the system.

6. Operating Temperature Range:

   • The device operates within the temperature range of -40°C to +85°C.

7. Handling Precautions:

   • Handle with care to avoid damage to the sensitive components.
   • Follow standard ESD handling procedures during assembly and testing.

(For reference only)