Details

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BUY BU4066BCFV-E2 https://www.utsource.net/itm/p/1457758.html
High Voltage CMOS Logic ICs<Analog Switch>; Package: SSOP-B14; Constitution materials list: Packing style: Embossed Tape And Reel; Package quantity: 2500; Minimum package quantity: 2500;

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VDD	Operating condition	1.6	-	3.6	V
Output Current	IO	Per channel	-	50	-	mA
Operating Temperature	TOPR	Junction	-40	-	85	°C
Storage Temperature	TSTG	-	-55	-	150	°C
Input Leakage Current	IIH	VIN = VDD, TA = 25°C	-	1	-	μA
Output Leakage Current	IOL	VIN = 0V, TA = 25°C	-	1	-	μA
Propagation Delay Time	tpd	VDD = 3.0V, TA = 25°C	10	-	20	ns
Power Dissipation	PD	Per package	-	-	150	mW

Instructions for BU4066BCFV-E2:

1. Supply Voltage (VDD):

   • Ensure the supply voltage is within the range of 1.6V to 3.6V to avoid damage and ensure proper operation.

2. Output Current (IO):

   • Each channel can source up to 50mA. Do not exceed this limit to prevent overheating or failure.

3. Operating Temperature (TOPR):

   • The device operates reliably between -40°C and 85°C. Avoid exposing it to temperatures outside this range during operation.

4. Storage Temperature (TSTG):

   • Store the device in an environment where temperatures range from -55°C to 150°C to maintain its integrity.

5. Input Leakage Current (IIH):

   • When the input voltage equals the supply voltage and at room temperature, the input leakage current should be around 1μA.

6. Output Leakage Current (IOL):

   • With the input voltage at 0V and at room temperature, the output leakage current should also be around 1μA.

7. Propagation Delay Time (tpd):

   • At a supply voltage of 3.0V and room temperature, the propagation delay time should be between 10ns and 20ns.

8. Power Dissipation (PD):

   • Ensure that the power dissipation does not exceed 150mW per package to prevent overheating.

For detailed specifications and further instructions, refer to the official datasheet provided by the manufacturer.

(For reference only)