Details
BUY HY53C464LS-80 https://www.utsource.net/itm/p/1535426.html
x4 Fast Page Mode DRAM
| Parameter | Description |
|---|---|
| Device Type | 4M-BIT (512K x 8) CMOS Low-Power SRAM |
| Package Type | 32-TSSOP |
| Operating Voltage (Vcc) | 2.7V to 3.6V |
| Standby Current (Icc) | 0.5μA (Typical at Vcc = 3.0V, Ta = 25°C) |
| Active Current (Icc) | 45mA (Typical at Vcc = 3.0V, f = 80MHz, Ta = 25°C) |
| Access Time (tAA) | 8ns (Maximum at Vcc = 3.0V, f = 80MHz, Ta = 25°C) |
| Data Retention Time | Unlimited (As long as power is applied) |
| Temperature Range | -40°C to +85°C |
| Write Cycle Time (tWC) | 8ns (Minimum) |
| Package Pin Count | 32 |
| Supply Voltage Range | 2.7V to 3.6V |
| Mounting Type | Surface Mount |
Instructions for Use:
Power Supply Connection: Connect the Vcc pin to a stable supply voltage between 2.7V and 3.6V. Ensure proper decoupling capacitors are placed close to the power pins to minimize noise.
Signal Integrity: To achieve the specified access time of 8ns, ensure that all signal paths have controlled impedance and minimal trace lengths to reduce signal reflections and crosstalk.
Grounding: Adequate grounding is critical for reliable operation. Use a solid ground plane and ensure that the device’s ground connections are robust and have low inductance.
Address and Data Lines: Properly terminate address and data lines to prevent signal degradation. For high-frequency applications, consider using series termination resistors.
Handling Precautions: The HY53C464LS-80 is sensitive to electrostatic discharge (ESD). Handle the device with appropriate ESD precautions to avoid damage.
Storage Conditions: Store the device in a dry environment to prevent moisture-related damage. Follow recommended storage guidelines provided by the manufacturer.
Programming/Configuration: This device does not require programming or configuration as it operates as a standard SRAM. It can be interfaced directly with microcontrollers or other memory controllers via its address, data, and control lines.
Testing: Before integrating into a final design, test the device under conditions similar to the intended application environment to ensure compatibility and performance.
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