Details
BUY DSEI2X61-08B https://www.utsource.net/itm/p/1571208.html
ARRAY OF INDEPENDENT DIODES|SOT-227B
| Parameter | Description | Value |
|---|---|---|
| Part Number | Device identifier | DSEI2X61-08B |
| Type | Surface mount device | SMD |
| Package | Chip size | 0805 |
| Voltage Rating | Maximum voltage the component can handle | 60V |
| Capacitance | Ability to store electrical charge | 6.8渭F |
| Tolerance | Variability in capacitance value | 卤20% |
| Temperature Coefficient | Change in capacitance with temperature | X7R |
| Operating Temperature | Range of temperatures under which it can operate | -55掳C to +125掳C |
| Insulation Resistance | Resistance against leakage current | 1000M惟 min |
| Dielectric Material | Material used for the dielectric layer | Ceramic |
Instructions:
- Mounting: Place the DSEI2X61-08B on the PCB ensuring correct orientation if applicable. This component is non-polarized.
- Soldering: Use a temperature-controlled soldering iron set no higher than 300掳C to avoid damaging the component.
- Inspection: After soldering, inspect the connections for any shorts or poor solder joints.
- Storage: Store in a dry environment to prevent moisture absorption which can affect performance.
- Handling: Handle with care to avoid mechanical damage; do not apply excessive force or torque.
- Testing: Test the assembled board using appropriate test procedures to ensure proper functionality and adherence to specifications.
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