DSEI2X61-08B

DSEI2X61-08B


Specifications
SKU
1571208
Details

BUY DSEI2X61-08B https://www.utsource.net/itm/p/1571208.html
ARRAY OF INDEPENDENT DIODES|SOT-227B
Parameter Description Value
Part Number Device identifier DSEI2X61-08B
Type Surface mount device SMD
Package Chip size 0805
Voltage Rating Maximum voltage the component can handle 60V
Capacitance Ability to store electrical charge 6.8渭F
Tolerance Variability in capacitance value 卤20%
Temperature Coefficient Change in capacitance with temperature X7R
Operating Temperature Range of temperatures under which it can operate -55掳C to +125掳C
Insulation Resistance Resistance against leakage current 1000M惟 min
Dielectric Material Material used for the dielectric layer Ceramic

Instructions:

  1. Mounting: Place the DSEI2X61-08B on the PCB ensuring correct orientation if applicable. This component is non-polarized.
  2. Soldering: Use a temperature-controlled soldering iron set no higher than 300掳C to avoid damaging the component.
  3. Inspection: After soldering, inspect the connections for any shorts or poor solder joints.
  4. Storage: Store in a dry environment to prevent moisture absorption which can affect performance.
  5. Handling: Handle with care to avoid mechanical damage; do not apply excessive force or torque.
  6. Testing: Test the assembled board using appropriate test procedures to ensure proper functionality and adherence to specifications.
(For reference only)

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