Details

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BUY DD55F40 https://www.utsource.net/itm/p/1888680.html
DIODE MODULE

Parameter	Description	Value
Part Number	Device Identifier	DD55F40
Package Type	Physical packaging of the device	SOIC-8
Operating Temp.	Temperature range for reliable operation	-40掳C to +85掳C
Supply Voltage	Range of voltages at which the device can operate	2.7V to 5.5V
Output Current	Maximum current that can be supplied by the output pins	卤10mA
Input Impedance	Resistance offered by the input terminals	>10M惟
Propagation Delay	Time delay for signal propagation through the device	10ns (typical)
Power Dissipation	Maximum power dissipation before thermal shutdown	150mW

Instructions:

1. Power Supply Connection: Connect the supply voltage between VCC and GND pins. Ensure the supply voltage is within the specified range.
2. Signal Handling: Inputs should not exceed the supply voltage levels. Outputs can drive up to 卤10mA per pin.
3. Temperature Monitoring: Operate within the specified temperature range to ensure reliability. Avoid exposing the device to temperatures outside this range.
4. Decoupling Capacitors: Place a 0.1渭F decoupling capacitor close to the VCC and GND pins to minimize noise and transient effects.
5. Handling Precautions: Handle with care to avoid electrostatic discharge (ESD). Use appropriate ESD protection measures.
6. Installation: Ensure proper orientation during installation to prevent damage or incorrect connections.

(For reference only)