Details
BUY IRF3704Z https://www.utsource.net/itm/p/4568264.html
HEXFET Power MOSFET
| Parameter | Symbol | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Drain-Source Voltage | V(DS) | - | - | 55 | V |
| Gate-Source Voltage | V(GS) | -12 | - | 20 | V |
| Continuous Drain Current | I(D) | - | 4.3 | - | A |
| Pulse Drain Current | I(DM) | - | 16 | - | A |
| Power Dissipation | P(TOT) | - | - | 27 | W |
| Junction Temperature | T(J) | - | - | 150 | 掳C |
| Storage Temperature | T(STG) | -55 | - | 150 | 掳C |
Instructions for Use:
Handling Precautions:
- The IRF3704Z is sensitive to electrostatic discharge (ESD). Handle with care and use proper ESD protection measures.
Mounting:
- Ensure good thermal management by using heat sinks if necessary, especially when operating near maximum power dissipation levels.
Biasing:
- Apply gate voltages within the specified limits to avoid damage or unreliable operation. The typical operating range for V(GS) is between 0V and 10V for optimal performance.
Current Limitation:
- Do not exceed the continuous drain current rating of 4.3A or the pulse drain current rating of 16A to prevent overheating and potential failure.
Thermal Considerations:
- Monitor the junction temperature to ensure it does not exceed 150掳C. Proper cooling mechanisms should be implemented in high-power applications.
Storage Conditions:
- Store the device in a controlled environment where temperatures do not fall below -55掳C or rise above 150掳C.
Testing:
- When testing the device, ensure all parameters are within the specified limits to avoid damaging the component.
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