M25P128-VME6G

M25P128-VME6G

Category: IC Chips

Specifications
SKU
4826345
Details

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128 Mbit (Multilevel), Low Voltage, Serial Flash Memory With 50MH SPI Bus Interface
Parameter Symbol Min Typ Max Unit Description
Supply Voltage VCC 2.7 - 3.6 V Operating voltage range
Standby Current ISB - 1 2 μA Power-down mode current
Active Current IAV - 10 20 mA Current in active mode
Programming Current IPR - 4 5 mA Current during page programming
Erase Time TEB 3 - 5 s Sector/block erase time
Page Program Time TPP 0.5 - 2 ms Time to program a page
Read Cycle Time TRC 25 - 40 ns Time between read commands
Data Output Setup Time tSO 0 - 10 ns Data output setup time
Data Output Hold Time tOH 0 - 10 ns Data output hold time
Command Latch Cycle Time TCS 0 - 20 ns Time for command latch cycle
Address Latch Cycle Time TAS 0 - 20 ns Time for address latch cycle
Write Enable Setup Time tSUW 0 - 20 ns Write enable setup time
Write Enable Hold Time tHOLDW 0 - 5 ns Write enable hold time

Instructions:

  1. Power Supply: Ensure the supply voltage (VCC) is within the specified range of 2.7V to 3.6V.
  2. Initialization: Before any operation, initialize the device by applying the appropriate power and ensuring the chip select pin is high.
  3. Programming: To program a page, apply the write enable command followed by the page program command. Ensure the programming current (IPR) does not exceed 5mA.
  4. Erase Operations: For sector or block erasure, use the appropriate erase command. Wait for the specified erase time (TEB) before performing any other operations.
  5. Read Operations: Execute read commands with proper timing parameters such as read cycle time (TRC), data output setup time (tSO), and data output hold time (tOH).
  6. Timing Requirements: Adhere strictly to all timing requirements listed to ensure reliable operation, including command and address latch times (TCS, TAS), and write enable setup and hold times (tSUW, tHOLDW).
(For reference only)

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