Details
BUY MT48LC2M32B2TG-6G https://www.utsource.net/itm/p/4906665.html
Parameter | Description | Value |
---|---|---|
Device Name | Micron Technology MT48LC2M32B2TG-6G | |
Type | SDRAM | |
Capacity | 2M x 32 bits | |
Package | TQFP (Thin Quad Flat Package) | |
Supply Voltage (Vcc) | Operating voltage | 3.3V |
Supply Voltage (Vccq) | I/O supply voltage | 3.3V |
Access Time (tAC) | Access time from clock | 6ns |
Cycle Time (tRC) | Row cycle time | 60ns |
Refresh Rate | Refresh rate | 8K refresh cycles/64ms |
Operating Temperature | Industrial temperature range | -40°C to +85°C |
Data Width | Data bus width | 32 bits |
CAS Latency | Column Address Strobe latency | CL=2 |
Power Consumption | Active power consumption | 170mW |
Standby Power | Standby power consumption | 2mW |
Instructions for Use:
Power Supply Configuration:
- Ensure Vcc and Vccq are set to 3.3V.
- Use appropriate decoupling capacitors near the power pins to minimize noise.
Initialization:
- Perform a reset operation after applying power.
- Set up mode register as per application requirements.
Timing Parameters:
- Respect tAC and tRC timings in your system design to ensure reliable operation.
- Configure refresh intervals correctly to prevent data loss.
Memory Operations:
- Execute read/write commands according to the device's timing diagram.
- Manage bank switching and burst lengths efficiently for optimal performance.
Thermal Considerations:
- Ensure adequate heat dissipation, especially in high-performance applications.
- Monitor operating temperatures within the specified range to avoid overheating.
Handling Precautions:
- Handle with care to avoid damage from electrostatic discharge (ESD).
- Follow standard PCB layout guidelines to minimize signal integrity issues.
End-of-Life and Disposal:
- Refer to local regulations for disposal of electronic components.
- Recycle or dispose of the product responsibly at its end-of-life.
View more about MT48LC2M32B2TG-6G on main site