OPA140AIDR

OPA140AIDR

Category: IC Chips

Specifications
SKU
4965589
Details

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High-Precision, Low-Noise, Rail-to-Rail Output 11MHz JFET Op Amp
Parameter Symbol Test Conditions Min Typ Max Unit
Supply Voltage VCC -0.3 7 V
Input Voltage Range VI Relative to each input -0.3 VCC+0.3 V
Output Voltage Swing VO RL = 1kΩ, VS = ±5V -4.5 ±4.8 4.5 V
Input Offset Voltage VOS Initial -25 5 25 μV
Input Bias Current IB -1 0.1 1 nA
Slew Rate SR VS = ±15V 1.6 V/μs
Gain Bandwidth Product GBP VS = ±15V 9 MHz
Unity Gain Frequency fT VS = ±15V 15 MHz
Power Supply Rejection Ratio PSRR f = 1kHz, VS = ±15V 100 dB
Common Mode Rejection Ratio CMRR VS = ±15V 120 dB

Instructions for OPA140AIDR:

  1. Supply Voltage Configuration:

    • Ensure the supply voltage (VCC) is within the specified range of -0.3V to 7V.
  2. Input Signal Handling:

    • Keep the input voltage (VI) within the safe operating limits relative to the inputs.
    • Avoid exceeding the input voltage range to prevent damage or unreliable operation.
  3. Output Load Management:

    • For optimal performance, ensure the load resistance (RL) allows the output voltage swing to stay within the specified limits.
  4. Minimizing Offset and Bias Effects:

    • Account for the initial input offset voltage (VOS) and bias current (IB) in your circuit design to minimize errors.
  5. Performance Optimization:

    • Utilize the gain bandwidth product (GBP) and unity gain frequency (fT) to optimize the operational amplifier's performance for your application.
    • Consider the slew rate (SR) for applications involving rapid signal changes.
  6. Noise and Interference Mitigation:

    • Leverage the power supply rejection ratio (PSRR) and common mode rejection ratio (CMRR) to mitigate the effects of noise and interference from the power supply and common-mode signals.
  7. Handling and Storage:

    • Store and handle the device in accordance with standard ESD precautions to avoid damage.
  8. Circuit Design Recommendations:

    • Refer to the manufacturer’s datasheet for detailed recommendations on component selection, layout guidelines, and thermal considerations.
(For reference only)

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