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High Speed 1Mb/s, High CMR Mini-fl at Package OPIC Photo-coupler
| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Input Voltage | VIN | 60 | V | Maximum input voltage | ||
| Output Voltage | VOUT | 5 | V | Regulated output voltage | ||
| Quiescent Current | IQ | 1.2 | mA | Supply current with no load | ||
| Output Current | IOUT | 700 | mA | Continuous output current | ||
| Dropout Voltage | VDROPOUT | 0.8 | V | Voltage difference between VIN and VOUT at maximum load | ||
| Operating Temperature | TOPR | -40 | 85 | 掳C | Operating temperature range | |
| Storage Temperature | TSTG | -65 | 150 | 掳C | Storage temperature range | |
| Thermal Resistance | R胃JA | 160 | 掳C/W | Junction-to-ambient thermal resistance |
Instructions for Use:
Power Supply Connection:
- Connect the input voltage (VIN) to a power source within the specified range of up to 60V.
- Ensure that the output voltage (VOUT) is connected to the load requiring a regulated 5V supply.
Current Limitation:
- Do not exceed the continuous output current rating of 700mA to avoid overheating or damage.
Thermal Management:
- The device can operate in environments from -40掳C to 85掳C. For applications outside this range, consult the storage temperature specifications.
- To manage heat effectively, ensure adequate ventilation or use a heatsink if necessary, especially when operating near the maximum output current.
Stability Considerations:
- Add appropriate decoupling capacitors close to the input and output terminals to ensure stability and reduce noise.
Handling Precautions:
- Handle the component carefully to avoid damage from electrostatic discharge (ESD). Follow standard ESD handling procedures.
Mounting Orientation:
- Mount the device according to the manufacturer's guidelines to ensure proper thermal performance and mechanical integrity.
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