Details
BUY SI7898DP-T1-GE3 https://www.utsource.net/itm/p/5133907.html
MOSFET N-CH 150V 3A PPAK 8SOIC
| Parameter | Description |
|---|---|
| Part Number | SI7898DP-T1-GE3 |
| Type | MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) |
| Configuration | N-Channel |
| Package Type | TO-252 (DPAK) |
| Drain Source Voltage | 60V |
| Continuous Drain Current | 40A (at 25掳C case temperature) |
| Rds(on) | 4.5 m惟 (max at Vgs=10V, Id=20A) |
| Gate Charge | 45 nC |
| Power Dissipation | 31W (at 25掳C ambient temperature) |
| Operating Temperature Range | -55掳C to +175掳C |
| Storage Temperature Range | -65掳C to +150掳C |
| Mounting Type | Surface Mount |
Instructions for Use:
- Handling Precautions: This device is sensitive to electrostatic discharge (ESD). Handle with care and use appropriate ESD protection measures.
- Thermal Management: Ensure adequate heat sinking to manage the power dissipation especially when operating near maximum current levels.
- Voltage Ratings: Do not exceed the maximum drain-source voltage (Vds) of 60V to prevent damage to the device.
- Current Limitations: The continuous drain current should not exceed 40A at a case temperature of 25掳C. For higher temperatures, derate accordingly.
- Gate Drive: Ensure that the gate drive voltage is within the specified range to avoid excessive Rds(on) or potential damage.
- PCB Layout: Optimize PCB layout for low inductance paths between the source and ground connections to enhance performance and reliability.
- Soldering: Follow recommended soldering profiles to avoid thermal stress on the component during assembly.
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