Details

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BUY ZXMHN6A07T8TA https://www.utsource.net/itm/p/5426709.html
60V N-CHANNEL MOSFET H-BRIDGE

Parameter	Symbol	Min	Typ	Max	Unit	Description
Drain-Source Voltage	VDSS			600	V	Maximum drain-source voltage
Gate-Source Voltage	VGS	-10		10	V	Maximum gate-source voltage
Continuous Drain Current	ID		7		A	Continuous drain current at TC = 25°C
Pulse Drain Current	Ipp		45		A	Pulse drain current (t < 10 μs)
Total Power Dissipation	PD			80	W	Maximum total power dissipation at TC = 25°C
Junction Temperature	Tj	-55		150	°C	Operating junction temperature range
Storage Temperature	Tstg	-55		150	°C	Storage temperature range
Gate Charge	Qg		90		nC	Total gate charge
Input Capacitance	Ciss		3300		pF	Input capacitance at VDS = 10 V, VGS = 0 V
Output Capacitance	Coss		100		pF	Output capacitance at VDS = 10 V, ID = 0 mA
Reverse Transfer Capacitance	Crss		100		pF	Reverse transfer capacitance at VDS = 10 V, VGS = 0 V

Instructions for Use:

1. Voltage and Current Limits:

   • Ensure that the drain-source voltage (VDSS) does not exceed 600V.
   • Keep the gate-source voltage (VGS) within ±10V to prevent damage.
   • Do not exceed the continuous drain current (ID) of 7A or pulse drain current (Ipp) of 45A for short pulses.

2. Power Dissipation:

   • The device can dissipate up to 80W of power at a case temperature (TC) of 25°C. Ensure adequate heat sinking if operating near this limit.

3. Temperature Considerations:

   • Operate the device within the specified junction temperature range (-55°C to 150°C).
   • Store the device in environments where the temperature remains between -55°C and 150°C.

4. Capacitance Parameters:

   • Be aware of the input capacitance (Ciss), output capacitance (Coss), and reverse transfer capacitance (Crss) values for circuit design considerations.

5. Gate Drive Requirements:

   • Account for the total gate charge (Qg) when designing the gate drive circuitry to ensure proper switching performance.

6. Handling Precautions:

   • Handle with care to avoid static damage. Follow ESD handling procedures.
   • Ensure all connections are secure and correct to prevent electrical overstress or short circuits.

7. Application Notes:

   • Refer to the manufacturer’s application notes for detailed guidelines on optimal use in specific applications.

(For reference only)