Details

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BUY M30626FHPGP#U7C https://www.utsource.net/itm/p/6390623.html
IC MCU 16BIT 384KB FLASH 100QFP

Parameter	Value
Product Name	M30626FHPGP#U7C
Manufacturer	Micron Technology
Type	DRAM
Capacity	512 Mb (64M x 8)
Package	FBGA (Fine Pitch Ball Grid Array)
Pin Count	78
Voltage Supply	2.5V
Data Width	8 bits
Speed	667 MHz
Operating Temperature	-40掳C to +85掳C
Case/Package	TFBGA-78
Memory Architecture	DDR2 SDRAM
CAS Latency	CL=5
RAS# to CAS# Delay	tRCD=5 cycles
Row Precharge Time	tRP=5 cycles
Refresh Rate	8K refreshes per second
Power Down Mode	Self-refresh, deep power down
Mounting Style	Surface Mount

Instructions for Use:

1. Handling and Storage:

   • Handle with care to avoid damage to the pins and package.
   • Store in a dry environment to prevent moisture damage.

2. Mounting:

   • Ensure proper alignment of the component during mounting.
   • Follow standard surface mount technology (SMT) procedures for installation.

3. Power-Up Sequence:

   • Apply the supply voltage (VDD) before enabling the device.
   • Ensure stable power supply before initializing memory operations.

4. Initialization:

   • Perform a reset or initialization sequence as specified in the datasheet.
   • Configure mode register settings according to system requirements.

5. Operation:

   • Operate within specified voltage and temperature ranges.
   • Maintain appropriate timing parameters such as CAS latency and RAS# to CAS# delay.

6. Termination:

   • Use appropriate termination resistors on signal lines to minimize reflections and ensure reliable operation.

7. Power Down:

   • Enter self-refresh or deep power-down modes when not actively using the memory to conserve power.

8. Testing:

   • Conduct functional tests after assembly to verify correct operation.
   • Regularly monitor performance and reliability over time.

For detailed specifications and advanced configurations, refer to the official datasheet provided by Micron Technology.

(For reference only)