Details

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BUY XC3S50A-4TQG144I https://www.utsource.net/itm/p/6391195.html
SPARTAN-3A FPGA 50K 144-TQFP

Parameter	Description
Device	XC3S50A
Package	TQG144 (144-pin Thin Quad Flatpack)
Speed Grade	-4
Configuration Memory	50,688 Cells
Logic Cells	50 logic cells
I/O Pins	92
Dedicated Multipliers	4 (18x18-bit)
Block RAM	12KB
Internal Oscillator	No
External Clock Inputs	2
Operating Voltage	1.2V core, 3.3V I/O
Temperature Range	Commercial: 0掳C to 70掳C, Industrial: -40掳C to 85掳C
Configuration Mode	Master/Slave Serial, SelectMAP
Configuration Flash	Optional external device
Configuration Time	< 10ms
Power Consumption	Low power design

Instructions for XC3S50A-4TQG144I

1. Power Supply Connections:

   • Connect VCCO (pins as per datasheet) to 3.3V for I/O.
   • Connect VCCAUX and VCCINT to 1.2V for internal and auxiliary supplies.
   • Ensure stable decoupling capacitors are placed close to the power pins.

2. Configuration:

   • Use either a serial or SelectMAP configuration method depending on your setup.
   • If using an external flash memory for configuration, ensure it is compatible with the device's voltage requirements.
   • Configuration can be done through JTAG, Boundary Scan, or dedicated configuration pins.

3. Clocking:

   • Utilize the two external clock inputs for clock signals. The internal DLL can be used for phase alignment and duty cycle correction.

4. Signal Integrity:

   • For high-speed signals, use differential pairs where applicable.
   • Ensure proper termination resistors are used to minimize reflections and crosstalk.

5. Grounding and Layout:

   • Maintain a solid ground plane under the FPGA to reduce noise.
   • Keep signal traces short and direct to minimize delays and interference.

6. Testing and Verification:

   • After programming, verify the functionality using boundary scan testing via JTAG.
   • Monitor power consumption and temperature during operation to ensure they remain within specified limits.

7. Handling:

   • Handle the device with care to avoid ESD damage. Use appropriate anti-static measures when handling or soldering the device.

For detailed specifications and advanced configurations, refer to the official Xilinx documentation or datasheet for the XC3S50A-4TQG144I.

(For reference only)