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BUY CSD18534Q5A https://www.utsource.net/itm/p/6396912.html
60-V N-Channel NexFET Power MOSFETs
Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
---|---|---|---|---|---|---|
Drain-Source Voltage | VDS | -100 | 100 | V | ||
Gate-Source Voltage | VGS | -8 | 20 | V | ||
Continuous Drain Current | ID | 76 | A | TC = 25°C | ||
Pulse Drain Current | IDM | 340 | A | TP = 10 ms, TC = 25°C | ||
RDS(on) at VGS = 10V | RDS(on) | 3.6 | mΩ | TC = 25°C | ||
Gate Charge | QG | 104 | nC | VGS = 10V | ||
Input Capacitance | Ciss | 2120 | pF | VDS = 0V | ||
Output Capacitance | Coss | 260 | pF | VDS = 100V | ||
Reverse Transfer Capacitance | Crss | 1020 | pF | VDS = 100V |
Instructions for Use:
- Voltage Ratings: Ensure that the drain-source voltage (VDS) and gate-source voltage (VGS) do not exceed their maximum ratings to prevent damage to the device.
- Current Handling: The continuous drain current (ID) and pulse drain current (IDM) should be within specified limits. Pay attention to thermal conditions as they can affect these values.
- Thermal Management: Keep the junction temperature within safe operating limits by ensuring adequate heat dissipation, especially when operating near maximum current ratings.
- Switching Applications: For switching applications, consider the gate charge (QG) and capacitance parameters (Ciss, Coss, Crss) which impact switching speed and efficiency.
- Installation: Ensure proper installation with respect to PCB layout to minimize inductance and maximize performance, particularly for high-frequency switching applications.
- Handling Precautions: Handle the device carefully to avoid electrostatic discharge (ESD) damage. Use appropriate ESD protection measures during handling and assembly.
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