Details

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BUY LE80554 800/0M/400 SL8XT https://www.utsource.net/itm/p/6443448.html

Parameter	Value/Description
Part Number	LE80554 800/0M/400 SL8XT
Type	Lead Frame
Material	Copper Alloy
Finish	Matte Tin
Lead Count	8
Pitch	0.635 mm (25 mil)
Body Size	3.00 mm x 3.00 mm
Height	0.20 mm
Package Type	SOP (Small Outline Package)
Operating Temperature	-55掳C to +125掳C
RoHS Compliance	Yes
Halogen-Free	Yes
Application	General-purpose IC packaging, power management, signal processing

Instructions:

1. Handling and Storage:

   • Store in a dry environment with controlled humidity.
   • Handle with ESD (Electrostatic Discharge) precautions to prevent damage.

2. Mounting:

   • Ensure the correct orientation of the component during mounting.
   • Apply appropriate soldering temperature profiles as per industry standards to avoid thermal stress.

3. Inspection:

   • Visually inspect leads for any defects or damages before assembly.
   • Use automated optical inspection (AOI) for quality assurance post-assembly.

4. Usage:

   • Suitable for applications requiring robust performance in compact designs.
   • Ideal for use in automotive, industrial, and consumer electronics where reliability is critical.

(For reference only)