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MOSFET N-CH 200V 11.3A 8TDSON
Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
---|---|---|---|---|---|---|
Drain-Source On-State Resistance | RDS(on) | - | 1.4 | - | mΩ | VGS = 10V, ID = 12A |
Gate Charge | QG | - | 39 | - | nC | |
Input Capacitance | Ciss | - | 1650 | - | pF | VDS = 15V |
Output Capacitance | Coss | - | 380 | - | pF | VDS = 15V |
Reverse Transfer Capacitance | Crss | - | 100 | - | pF | VDS = 15V |
Total Power Dissipation | PD | - | - | 200 | W | Case Temp |
Junction Temperature | Tj | - | - | 175 | °C | |
Storage Temperature Range | Tstg | -55 | - | 150 | °C |
Instructions for Use:
- Mounting and Handling: Handle with care to avoid damage to the device. Ensure proper mounting techniques are used to maintain thermal performance.
- Thermal Consideration: Ensure adequate heat sinking when operating at high power levels to prevent exceeding the maximum junction temperature.
- Electrical Stress: Avoid subjecting the device to electrical stress beyond its rated parameters. Pay particular attention to VDS(max) and ID(max).
- Gate Drive Requirements: For optimal performance, ensure the gate drive voltage and current meet the specified requirements, especially to minimize RDS(on).
- Storage and Operation: Store in a dry environment within the specified storage temperature range. Operate within the recommended operating conditions to ensure reliability.
- Soldering: Follow standard soldering practices suitable for surface mount devices. Avoid excessive heat during soldering to prevent damage to the component.
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