Details
BUY 2N5446 https://www.utsource.net/itm/p/6524924.html
N/A
Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
---|---|---|---|---|---|---|
Collector-Emitter Voltage | V(BR)CEO | - | - | 30 | V | IC = 10mA, IE = 0 |
Emitter-Base Voltage | V(BR)EBO | - | - | 6 | V | IE = 5mA |
Collector-Base Voltage | V(BR)CBO | - | - | 30 | V | IC = 10mA, IB = 0 |
Collector Current | IC | - | - | 100 | mA | VCE = 30V |
Base Current | IB | - | - | 5 | mA | VCE = 30V |
Power Dissipation | PD | - | - | 300 | mW | TC = 25°C |
Total Device Dissipation | PTOT | - | - | 300 | mW | TC = 25°C |
Junction Temperature | TJ | - | - | 150 | °C | |
Storage Temperature | TSTG | -55 | - | 150 | °C |
Instructions for Use:
- Handling Precautions: The 2N5446 is a silicon NPN transistor and should be handled with care to avoid damage from electrostatic discharge (ESD). Use proper ESD protection measures during handling.
- Biasing: Ensure the base-emitter junction is forward biased for proper operation. Typically, a small base current controls a larger collector current.
- Operating Conditions: Operate within specified voltage and current limits to prevent damage. Pay special attention to maximum ratings for collector-emitter and emitter-base voltages.
- Heat Management: Since the maximum power dissipation is limited, ensure adequate heat sinking if operating near maximum power levels.
- Mounting: For surface mount devices, follow recommended soldering profiles to avoid thermal stress.
- Testing: When testing or measuring parameters, use conditions as close as possible to those specified in the table for accurate results.
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