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BUY 6MBP75RS120 https://www.utsource.net/itm/p/6526812.html
IGBT-IPM1200V/75A
| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Blocking Voltage | V(BR)DSS | - | 1200 | - | V | Maximum repetitive peak off-state drain-to-source voltage |
| Continuous Drain Current | ID | - | 6 | - | A | Continuous drain current at Tc = 25掳C |
| Pulse Drain Current | IGM(DC) | - | 18 | - | A | Non-repetitive peak pulse drain current (t = 10 渭s, IGBT mode) |
| Total Energy Snubberless | EAS | - | 3.4 | - | mJ | Avalanche energy capability |
| Input Capacitance | Ciss | - | 3700 | - | pF | Input capacitance at VDS = 600 V |
| Output Capacitance | Coss | - | 290 | - | pF | Output capacitance at VDS = 600 V |
| Reverse Transfer Capacitance | Crss | - | 970 | - | pF | Reverse transfer capacitance at VDS = 600 V |
| Gate Charge | Qg | - | 110 | - | nC | Total gate charge at VGS = 卤15 V |
| Threshold Voltage | VGS(th) | 2.5 | 4.5 | 7 | V | Gate threshold voltage |
| On-State Resistance | RDS(on) | - | 75 | - | m惟 | On-state resistance at VGS = 10 V |
Instructions for Use:
Handling Precautions:
- The 6MBP75RS120 is sensitive to electrostatic discharge (ESD). Handle with care using proper ESD protection measures.
Mounting:
- Ensure the device is securely mounted on a heatsink to dissipate heat effectively. Thermal interface materials can be used to enhance thermal performance.
Voltage and Current Ratings:
- Do not exceed the maximum blocking voltage or continuous drain current ratings. Exceeding these limits can cause permanent damage to the device.
Gate Drive:
- Apply gate drive voltages within specified limits to ensure reliable operation. Avoid rapid switching of gate voltages to prevent oscillations.
Snubber Circuits:
- For high dv/dt applications, consider using snubber circuits to protect against transient overvoltages.
Thermal Management:
- Monitor the junction temperature to ensure it remains within operational limits. Proper ventilation and cooling methods are crucial.
Testing:
- Before deploying in final applications, thoroughly test the device under conditions that mimic the actual operating environment.
Storage:
- Store in a dry, cool place away from direct sunlight and sources of electromagnetic interference.
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