Details
BUY 2MBI450UE-120 https://www.utsource.net/itm/p/6527234.html
DUAL IGBT
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Breakdown Voltage | V(BR)DSS | - | 450 | - | V | Tj = 25°C |
| Continuous Drain Current | ID | - | 120 | - | A | Tc = 25°C, Pulse width ≤ 300 μs |
| Power Dissipation | PD | - | - | 290 | W | Tc = 25°C |
| Junction Temperature | TJ | -100 | - | 175 | °C | Storage and Operation |
| Total Device Dissipation | PTOT | - | - | 300 | W | TC = 25°C, Single pulse |
| Gate Threshold Voltage | VGS(th) | 2 | 4 | 6 | V | ID = 1 mA, Tj = 25°C |
| Input Capacitance | Ciss | - | 2000 | - | pF | VDS = 450V, VGS = 0V |
| Output Capacitance | Coff | - | 280 | - | pF | VDS = 450V, VGS = 0V |
Instructions for Use:
- Installation: Ensure the device is mounted on a heatsink or cooling system to maintain optimal operating temperatures.
- Handling: Handle with care to avoid damage to the sensitive gate structure. Use appropriate ESD protection.
- Biasing: Apply gate-source voltage within specified limits to prevent gate oxide breakdown.
- Current Limiting: Operate within the continuous drain current limits to avoid overheating and potential failure.
- Pulse Width: For applications requiring high current pulses, ensure pulse width does not exceed recommended values to prevent excessive heating.
- Storage: Store in a dry environment away from direct sunlight and extreme temperatures.
- Testing: Perform initial testing under controlled conditions to verify performance parameters before full-scale deployment.
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