Details
BUY MG30G6EL2 https://www.utsource.net/itm/p/6527235.html
| Parameter | Description | Value | Unit |
|---|---|---|---|
| Part Number | Product identifier | MG30G6EL2 | |
| Type | Device type | MOSFET | |
| Package | Encapsulation type | TO-252 | |
| Drain-Source Voltage | Maximum voltage between drain and source | 30 | V |
| Gate-Source Voltage | Maximum voltage between gate and source | 卤12 | V |
| Continuous Drain Current | Maximum continuous current through the drain | 6.8 | A |
| Power Dissipation | Maximum power dissipation | 1.4 | W |
| Junction Temperature | Maximum operating temperature of the junction | -55 to 175 | 掳C |
| Gate Charge | Total gate charge | 29 | nC |
| Input Capacitance | Capacitance between gate and source | 500 | pF |
Instructions for Use:
- Handling Precautions: The MG30G6EL2 is sensitive to electrostatic discharge (ESD). Use appropriate ESD protection measures during handling.
- Mounting: Ensure proper heat sinking if operating near maximum power dissipation limits.
- Operating Conditions: Operate within specified voltage and current limits to avoid damage.
- Storage: Store in a dry, cool place away from direct sunlight and sources of heat.
- Soldering: Follow standard soldering practices for surface mount devices. Avoid excessive heat to prevent damage.
- Testing: Before installing into final applications, test the device under typical operating conditions to ensure functionality.
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