Details
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HIGH POWER SWITCHING APPLICATIONS MOTOR CONTROL APPLICATIONS
| Parameter | Description | Value/Range | Unit |
|---|---|---|---|
| Device Name | Automotive-grade 300V N-channel MOSFET | MG300Q1US41 | - |
| Drain-Source Voltage | Maximum drain-to-source voltage | 300 | V |
| Continuous Drain Current | Continuous drain current at 25°C ambient temperature | 78 | A |
| Pulse Drain Current | Peak pulse drain current | 360 | A |
| Gate-Source Voltage | Maximum gate-to-source voltage | ±20 | V |
| Rds(on) | On-resistance at Vgs=10V | 2.9 | mΩ |
| Input Capacitance | Input capacitance | 1400 | pF |
| Total Power Dissipation | Maximum total power dissipation (at Tc=25°C) | 210 | W |
| Junction Temperature | Maximum junction temperature | 175 | °C |
| Storage Temperature | Operating and storage temperature range | -55 to 175 | °C |
| Package Type | Package type | TO-220 | - |
Instructions for Use:
- Handling Precautions: This device is sensitive to electrostatic discharge (ESD). Handle with care and use appropriate ESD protection.
- Mounting: Ensure proper heat sinking when operating at high currents or power levels to maintain junction temperature within specified limits.
- Gate Drive: Apply gate drive voltages within the specified range to prevent damage or unreliable operation.
- Storage and Operation Temperature: Operate and store the device within the specified temperature range to ensure reliable performance.
- Pulse Current Handling: For applications involving pulse currents, ensure that the pulse duration and frequency are such that the average power dissipation remains within the device’s limits.
- PCB Layout: Follow recommended PCB layout guidelines to minimize parasitic inductances and optimize thermal performance.
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