Details

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BUY BSM25GD120DN120DNE3224 https://www.utsource.net/itm/p/6527573.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Blocking Voltage	V(BR)DSS	-	1200	-	V	Drain-Source Breakdown Voltage
Continuous Drain Current	ID	-	-	25	A	At Tc = 25掳C
Power Dissipation	PD	-	-	240	W	At Tc = 25掳C
Junction Temperature	TJ	-25	-	175	掳C	Operating Temperature Range
Gate Charge	QG	-	69	-	nC	Total Gate Charge
Input Capacitance	Ciss	-	3800	-	pF	At VDS = 500V, VGS = 0V
Output Capacitance	Coss	-	100	-	pF	At VDS = 500V, VGS = 0V
Reverse Transfer Capacitance	Crss	-	98	-	pF	At VDS = 500V, VGS = 0V

Instructions for Use:

1. Handling and Storage:

   • Store in a dry, cool environment.
   • Handle with care to avoid damage to the pins and body.

2. Mounting:

   • Ensure proper alignment of the component on the PCB.
   • Apply adequate pressure during soldering but avoid excessive force that could damage the component.

3. Operating Conditions:

   • Do not exceed the maximum ratings listed in the table.
   • Operate within the specified temperature range to ensure reliable performance.

4. Thermal Management:

   • Use appropriate heat sinks if operating near maximum power dissipation limits.
   • Ensure adequate ventilation or cooling mechanisms are in place.

5. Electrical Connections:

   • Verify all connections are secure and correctly made.
   • Pay special attention to gate-source voltage levels to prevent accidental overvoltage conditions.

6. Testing:

   • Perform initial testing under controlled conditions.
   • Monitor device parameters like temperature and current during operation to ensure they remain within safe limits.

For detailed specifications and more advanced applications, refer to the manufacturer's datasheet.

(For reference only)