Details

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BUY 7MBR15NE120-01 https://www.utsource.net/itm/p/6527921.html
MCU CMOS 20LD LOW PWR, 0C to +70C, 20-SSOP 208mil, TUBE

Parameter	Symbol	Min	Typ	Max	Unit	Description
Blocking Voltage	V(BR)		1200		V	Maximum repetitive peak reverse voltage
Average Rectified Current	I_F(AV)		15		A	RMS current at T_C = 70掳C
Peak Forward Surge Current	I_FM		400		A	Non-repetitive peak forward surge current, T_J = 25掳C, t = 10 ms
Reverse Recovery Time	t_rr		80		ns	Measured at I_T(AV) = 15 A, dI/dt = 100 A/渭s
Junction Temperature	T_J	-55		175	掳C	Operating junction temperature range
Storage Temperature	T_STG	-55		150	掳C	Operating storage temperature range

Instructions for Use:

1. Installation:

   • Ensure that the device is mounted on a heatsink if continuous operation near maximum current ratings is anticipated.
   • Follow proper mounting torque specifications to avoid damage to the device.

2. Handling Precautions:

   • Handle with care to prevent mechanical damage.
   • Avoid exposing the device to excessive humidity or corrosive environments.

3. Electrical Connections:

   • Ensure all connections are secure and correctly wired according to circuit diagrams.
   • Use appropriate wire gauges to handle the rated currents without overheating.

4. Operating Conditions:

   • Do not exceed the maximum ratings specified in the table.
   • Operate within the recommended temperature ranges to ensure reliability and longevity.

5. Surge Handling:

   • For applications involving high surge currents, ensure that the peak forward surge current (I_FM) does not exceed the non-repetitive peak forward surge current rating.

6. Thermal Management:

   • Monitor the junction temperature (T_J) to stay within operational limits, especially under heavy load conditions.
   • Utilize thermal simulation tools to predict performance under various operating conditions.

7. Storage:

   • Store in a dry, cool environment away from direct sunlight and sources of heat.
   • Keep packaging intact until ready for use to protect against electrostatic discharge (ESD).

8. Testing:

   • Before final assembly, test the device under controlled conditions to verify its performance parameters meet the application requirements.

(For reference only)