Details
BUY IXFN73N30Q https://www.utsource.net/itm/p/6528575.html
HiPerFET Power MOSFETs Q-Class
| Parameter | Symbol | Value | Unit | Conditions/Notes |
|---|---|---|---|---|
| Maximum Drain Voltage | VDSS | 30 | V | Maximum voltage between drain and source with gate shorted to source |
| Maximum Gate Source Volt. | VGS | ±20 | V | Maximum voltage between gate and source |
| Continuous Drain Current | ID | 73 | A | At Tc = 25°C, Ta = 25°C |
| Pulse Drain Current | Ipp | 180 | A | Pulse width ≤ 10 ms, duty cycle ≤ 1% |
| Total Power Dissipation | PD | 260 | W | At Tc = 25°C |
| Junction Temperature | Tj | -55 to +150 | °C | Operating junction temperature range |
| Storage Temperature | Tstg | -55 to +150 | °C | Storage and handling temperature range |
Instructions for IXFN73N30Q
Handling Precautions:
- The IXFN73N30Q is an electrostatic discharge (ESD) sensitive device. Handle with care using ESD-safe procedures.
- Avoid exposing the device to excessive moisture or humidity.
Mounting and Assembly:
- Ensure proper heat sinking when operating at high currents to maintain safe operating temperatures.
- Follow manufacturer guidelines for soldering profiles to prevent damage during assembly.
Operating Conditions:
- Do not exceed the maximum ratings listed in the parameter table.
- For reliable operation, ensure that the junction temperature remains within specified limits.
Testing and Troubleshooting:
- Use appropriate test equipment and methods to avoid damaging the device.
- If issues arise, check connections, power supply, and load conditions first.
Storage:
- Store in a dry environment away from direct sunlight and sources of heat.
- Keep devices in original packaging until ready for use to protect against ESD.
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