IXFN73N30Q

IXFN73N30Q


Specifications
SKU
6528575
Details

BUY IXFN73N30Q https://www.utsource.net/itm/p/6528575.html
HiPerFET Power MOSFETs Q-Class
Parameter Symbol Value Unit Conditions/Notes
Maximum Drain Voltage VDSS 30 V Maximum voltage between drain and source with gate shorted to source
Maximum Gate Source Volt. VGS ±20 V Maximum voltage between gate and source
Continuous Drain Current ID 73 A At Tc = 25°C, Ta = 25°C
Pulse Drain Current Ipp 180 A Pulse width ≤ 10 ms, duty cycle ≤ 1%
Total Power Dissipation PD 260 W At Tc = 25°C
Junction Temperature Tj -55 to +150 °C Operating junction temperature range
Storage Temperature Tstg -55 to +150 °C Storage and handling temperature range

Instructions for IXFN73N30Q

  1. Handling Precautions:

    • The IXFN73N30Q is an electrostatic discharge (ESD) sensitive device. Handle with care using ESD-safe procedures.
    • Avoid exposing the device to excessive moisture or humidity.
  2. Mounting and Assembly:

    • Ensure proper heat sinking when operating at high currents to maintain safe operating temperatures.
    • Follow manufacturer guidelines for soldering profiles to prevent damage during assembly.
  3. Operating Conditions:

    • Do not exceed the maximum ratings listed in the parameter table.
    • For reliable operation, ensure that the junction temperature remains within specified limits.
  4. Testing and Troubleshooting:

    • Use appropriate test equipment and methods to avoid damaging the device.
    • If issues arise, check connections, power supply, and load conditions first.
  5. Storage:

    • Store in a dry environment away from direct sunlight and sources of heat.
    • Keep devices in original packaging until ready for use to protect against ESD.
(For reference only)

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