Details

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BUY 2MBI600NT-060 https://www.utsource.net/itm/p/6529297.html
IGBT(600V 600A)

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Breakdown Voltage	V(BR)DSS			600	V
Forward Voltage	VF		2.0		V	IF = 5 A
Continuous Drain Current	ID			20	A	Tc = 25掳C
Pulse Drain Current	Ipp			60	A	Tc = 25掳C, tp = 10 渭s
Total Power Dissipation	Ptot			70	W	Tc = 25掳C
Junction Temperature	TJ	-40		150	掳C
Storage Temperature	Tstg	-55		150	掳C

Instructions for Use:

1. Handling Precautions:

   • Ensure that the device is handled with care to avoid damage from electrostatic discharge (ESD). Use appropriate ESD protection measures.

2. Mounting and PCB Layout:

   • Place the component in a well-ventilated area to ensure adequate heat dissipation.
   • Follow recommended PCB layout guidelines to minimize stray inductance and enhance thermal performance.

3. Operating Conditions:

   • Do not exceed the maximum ratings specified in the table to prevent damage or reduced lifetime of the component.
   • Ensure that the junction temperature does not exceed 150掳C during operation.

4. Testing and Validation:

   • Before deploying the component in a final design, conduct thorough testing under expected operating conditions to validate performance and reliability.

5. Storage:

   • Store in a dry, cool place away from direct sunlight and sources of heat.
   • Observe the storage temperature range (-55掳C to 150掳C) to maintain component integrity.

For detailed specifications and additional information, refer to the manufacturer's datasheet.

(For reference only)