Details
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| Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Blocking Voltage | V(BR)DSS | - | 1200 | - | V | |
| Continuous Drain Current | ID | - | 50 | - | A | Tc = 25°C, Pulse width ≤ 10 μs |
| Gate Threshold Voltage | VGS(th) | 2.0 | 4.0 | 6.0 | V | ID = 1 mA |
| Input Capacitance | Ciss | - | 3500 | - | pF | VDS = 500 V, f = 1 MHz |
| Output Capacitance | Coff | - | 270 | - | pF | VDS = 500 V, f = 1 MHz |
| Total Power Dissipation | PD | - | - | 190 | W | TC = 25°C |
| Junction Temperature | TJ | -25 | - | 175 | °C | |
| Storage Temperature | Tstg | -55 | - | 150 | °C |
Instructions:
- Handling Precautions: The BSM50GD120DN2E322 is sensitive to electrostatic discharge (ESD). Use appropriate ESD protection measures during handling and installation.
- Mounting: Ensure that the mounting surfaces are clean and free from contaminants. Apply thermal paste if necessary for optimal heat dissipation.
- Operating Conditions: Operate within specified voltage and current limits to avoid damage or reduced performance.
- Thermal Management: Monitor junction temperature to ensure it remains within safe operating limits. Proper heatsinking may be required depending on application.
- Testing: When testing the device, use recommended test conditions as specified in the datasheet to obtain accurate results.
- Storage: Store in a dry environment within the specified storage temperature range to prevent damage.
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