Details
BUY MG200Q1US41 https://www.utsource.net/itm/p/6529687.html
Triac; Thyristor Type:Logic Level; Peak Repetitive Off-State Voltage, Vdrm:400V; On State RMS Current, ITrms:12A; Gate Trigger Current QI, Igt:10mA; Current, It av:12A; Gate Trigger Current Max, Igt:10mA RoHS Compliant: Yes
Parameter | Description |
---|---|
Part Number | MG200Q1US41 |
Type | MOSFET - Metal-Oxide-Semiconductor Field-Effect Transistor |
Configuration | N-Channel |
VDS (Max Drain-Source Voltage) | 200 V |
RDS(on) (Max On-Resistance) | 4.1 mΩ @ VGS=10V, ID=38A |
ID (Max Drain Current) | 38 A @ 25°C, 30 A @ 100°C |
PD (Max Power Dissipation) | 207 W @ TC=25°C |
VGS (Gate-Source Voltage) | ±20 V |
fT (Transition Frequency) | 6.1 MHz |
Qg (Total Gate Charge) | 95 nC |
Package Type | TO-220AB |
Operating Temperature Range | -55°C to +150°C |
Instructions for Use:
- Handling Precautions: The MG200Q1US41 is sensitive to ESD (Electrostatic Discharge). Use appropriate ESD protection measures during handling and installation.
- Mounting: Ensure proper heat dissipation by mounting the device on a suitable heatsink. Refer to the thermal resistance specifications in the datasheet for optimal performance.
- Biasing: Apply gate voltage within the specified range to avoid damage. The gate-source voltage should not exceed ±20V.
- Current Limitation: Do not exceed the maximum drain current ratings to prevent overheating and potential failure.
- Storage: Store in a dry environment away from direct sunlight and sources of heat.
- Soldering: Follow standard soldering guidelines for through-hole components. Avoid excessive heat exposure during soldering.
For detailed application notes and more specific parameters, refer to the manufacturer's datasheet.
(For reference only)View more about MG200Q1US41 on main site