Details
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Parameter | Symbol | Min | Typ | Max | Unit | Description |
---|---|---|---|---|---|---|
Continuous Current | I_CONT | - | 120 | - | A | Continuous current capability |
Peak Current | I_PEAK | - | 250 | - | A | Peak current capability (t < 5 ms) |
On-State Resistance | R DS(on) | - | 4.5 | - | mΩ | On-state resistance at 25°C, V GS = 10 V |
Thermal Shutdown | T SD | - | 170 | - | °C | Thermal shutdown temperature |
Operating Temperature | T OP | -40 | - | 150 | °C | Operating junction temperature range |
Gate Charge | Q G | - | 95 | - | nC | Total gate charge |
Instructions for BTS5010-1E
Mounting and Layout:
- Ensure the device is mounted on a suitable heatsink to dissipate heat effectively.
- Keep the PCB layout compact to minimize parasitic inductance.
Power Supply:
- Use decoupling capacitors close to the supply pins to stabilize the power supply voltage.
- Ensure the supply voltage does not exceed the maximum ratings specified in the datasheet.
Gate Drive:
- Provide sufficient gate drive voltage to ensure the MOSFET turns on fully and minimizes on-resistance.
- Avoid excessive gate-source voltage to prevent damage.
Thermal Management:
- Monitor the operating temperature to stay within the operational limits.
- Implement thermal management techniques such as forced air cooling if necessary.
Protection Circuits:
- Incorporate overcurrent protection circuits to safeguard against excessive currents.
- Consider using TVS diodes to protect against transient voltages.
Handling Precautions:
- Handle the device with care to avoid ESD damage.
- Follow proper soldering procedures to prevent thermal shock to the component.
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