Details
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Parameter | Symbol | Min | Typ | Max | Unit | Description |
---|---|---|---|---|---|---|
Supply Voltage | VDD | 4.5 | - | 40 | V | Operating supply voltage range |
Continuous Drain | ID | - | 3.8 | - | A | Continuous drain current at Tc = 25°C |
Peak Pulse Current | IPP | - | 6 | - | A | Peak pulse current (Tc = 25°C, t = 1ms) |
RDS(on) | RDS(on) | 55 | - | 75 | mΩ | On-state resistance at Tc = 25°C |
Gate Threshold Volt. | VGS(th) | 1.2 | - | 2.5 | V | Gate threshold voltage |
Total Power Dissipation | PD | - | - | 0.9 | W | Total power dissipation |
Junction Temperature | TJ | -40 | - | 150 | °C | Operating junction temperature range |
Instructions for VND830EH:
- Power Supply: Ensure the supply voltage (VDD) is within the specified range of 4.5V to 40V.
- Current Handling: The device can handle a continuous drain current up to 3.8A at a case temperature (Tc) of 25°C. For peak pulse currents, it can withstand up to 6A for short durations (1ms).
- On-State Resistance: The on-state resistance (RDS(on)) varies between 55mΩ and 75mΩ depending on conditions, which affects power dissipation.
- Gate Drive: Apply a gate-source voltage (VGS) above the threshold (1.2V to 2.5V) to turn the device on. Adequate drive voltage ensures low RDS(on).
- Thermal Management: Keep the junction temperature (TJ) within -40°C to 150°C. Use appropriate heat sinks if necessary to manage heat during high current operations.
- Total Power Dissipation: Do not exceed the total power dissipation limit of 0.9W to avoid overheating and potential damage to the device.
For detailed specifications and application notes, refer to the manufacturer's datasheet.
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