Details
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Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
---|---|---|---|---|---|---|
Breakdown Voltage | V(BR)DSS | drain-source reverse voltage | - | 600 | - | V |
Continuous Drain Current | ID | Tc = 25°C | - | 15 | - | A |
Pulse Drain Current | Ipp | tp = 8/20μs, Tj = 25°C | - | 90 | - | A |
Gate Threshold Voltage | VGS(th) | ID = 1mA | 2.0 | 4.0 | 6.0 | V |
Input Capacitance | Ciss | VDS = 30V, f = 1MHz | - | 1750 | - | pF |
Output Capacitance | Coss | VDS = 30V, f = 1MHz | - | 160 | - | pF |
Reverse Transfer Capacitance | Crss | VDS = 30V, f = 1MHz | - | 135 | - | pF |
Total Gate Charge | Qg | VGS = 10V | - | 60 | - | nC |
Turn-on Delay Time | td(on) | VGS = 10V, RL = 1Ω | - | 15 | - | ns |
Rise Time | tr | VGS = 10V, RL = 1Ω | - | 12 | - | ns |
Turn-off Delay Time | td(off) | VGS = -5V, RL = 1Ω | - | 35 | - | ns |
Fall Time | tf | VGS = -5V, RL = 1Ω | - | 25 | - | ns |
Instructions for HFA15TB60:
Storage and Handling:
- Store in a dry environment to prevent moisture damage.
- Handle with care to avoid static discharge; use ESD-safe equipment.
Mounting:
- Ensure proper thermal management as the device can dissipate significant heat under load.
- Follow manufacturer guidelines for PCB layout to ensure optimal performance.
Biasing and Operation:
- Ensure gate voltage (VGS) is within specified limits to prevent damage or malfunction.
- Keep junction temperature within operational limits by using appropriate heatsinks or cooling solutions.
Testing:
- Use recommended test conditions for accurate parameter measurement.
- Verify all connections are secure and correct before applying power.
Safety:
- Always disconnect power when making adjustments or repairs.
- Use protective gear and follow safety protocols when handling high voltages.
For detailed application notes and further information, refer to the datasheet provided by the manufacturer.
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