Details
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Parameter | Symbol | Min | Typ | Max | Unit | Description |
---|---|---|---|---|---|---|
Input Voltage | V_in | 10 | - | 65 | V | Operating input voltage range |
Continuous Drain Current | I_D | - | 35 | - | A | Continuous drain current at T_C = 25°C |
Peak Pulse Current | I_p | - | 70 | - | A | Peak pulse current (10 μs, repetition rate 1%) |
Power Dissipation | P_T | - | - | 180 | W | Total power dissipation |
Junction Temperature | T_j | - | - | 175 | °C | Maximum junction temperature |
Storage Temperature | T_stg | -40 | - | 150 | °C | Operating storage temperature |
Gate Charge | Q_g | - | 100 | - | nC | Total gate charge |
Input Capacitance | Ciss | - | 2900 | - | pF | Input capacitance at V_DS = 400 V |
Output Capacitance | Coff | - | 500 | - | pF | Output capacitance at V_DS = 400 V |
Instructions for Use:
Mounting and Handling:
- Ensure proper handling to avoid damage from electrostatic discharge (ESD).
- Follow recommended soldering profiles to prevent thermal damage.
Operating Conditions:
- Operate within the specified input voltage and temperature ranges to ensure reliability.
- Keep continuous drain current within limits to prevent overheating.
Heat Management:
- Utilize appropriate heat sinks or cooling methods to manage power dissipation and maintain junction temperature below the maximum limit.
Pulse Current Considerations:
- For applications involving high peak currents, ensure that these are within the peak pulse current ratings and observe duty cycle limitations.
Gate Drive:
- Provide sufficient gate drive to fully turn on the device and minimize switching losses. Account for total gate charge in your circuit design.
Capacitance Awareness:
- Be aware of the input and output capacitances when designing circuits to minimize unwanted oscillations and ensure stable operation.
Storage:
- Store the device in a controlled environment within the specified storage temperature range to preserve its integrity.
For detailed specifications and application notes, refer to the manufacturer's datasheet.
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