Details

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BUY EPM2210F256I5N https://www.utsource.net/itm/p/6804654.html
IC CPLD 1700MC 7NS 256FBGA

Parameter	Description	Value/Range
Package Type	The type of package used for the component.	TQFP (Thin Quad Flat Package)
Pin Count	Number of pins on the device.	256
Operating Temperature	Range of temperatures under which the device can operate reliably.	-40°C to +85°C
Supply Voltage (VCC)	The voltage range required to power the device.	1.8V, 2.5V, or 3.3V
Configuration Memory	Size of configuration memory.	2,210 non-volatile memory bits
Logic Cells	Number of logic cells available for design implementation.	2,210
Dedicated Multiplier Cells	Number of dedicated multiplier cells for arithmetic operations.	20
Embedded Block RAM	Amount of embedded block RAM available.	Up to 120 Kbits
I/O Pins	Number of input/output pins available.	208
Clock Resources	Types and number of clock resources available.	Global clock network with phase-locked loop (PLL) support
Power Consumption	Typical power consumption under standard operating conditions.	Depends on application; refer to datasheet for specific values
Speed Grade	Indicates the speed performance grade of the device.	-5 (fastest)

Instructions for EPM2210F256I5N:

1. Powering the Device:

   • Ensure that the supply voltage (VCC) is set correctly to either 1.8V, 2.5V, or 3.3V as per your application requirements.

2. Configuration:

   • Use a suitable programming tool compatible with Altera devices to configure the device.
   • Follow the manufacturer’s guidelines for loading the configuration bitstream into the non-volatile memory.

3. Operating Temperature:

   • Operate the device within the specified temperature range (-40°C to +85°C) to ensure reliable performance.

4. Clock Setup:

   • Utilize the global clock network and PLL features for generating and distributing clock signals throughout the device.

5. Handling Static Electricity:

   • Handle the device with care to avoid damage from static electricity; use appropriate anti-static measures.

6. Signal Integrity:

   • Pay attention to signal integrity issues especially for high-speed signals by following good PCB layout practices.

7. Refer to Datasheet:

   • For detailed specifications and more in-depth information, always refer to the official datasheet provided by the manufacturer.

(For reference only)