Details

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BUY FDS6690AS https://www.utsource.net/itm/p/6832183.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Drain-Source On-Resistance	RDS(on)	VGS = 10V, ID = 2A		35		mΩ
Gate Threshold Voltage	VGS(th)	ID = 250μA	1.0	1.5	2.5	V
Continuous Drain Current	ID	TC = 25°C			6.7	A
		TC = 70°C			4.9	A
Power Dissipation	PD	TC = 25°C			210	mW
Total Device Dissipation	PTOT	TC = 70°C			180	mW
Junction Temperature	TJ		-40		150	°C
Storage Temperature	TSTG		-55		150	°C

Instructions for FDS6690AS:

1. Handling Precautions:

   • Avoid exposure to high temperatures and humidity.
   • Use proper ESD (Electrostatic Discharge) protection when handling the device.

2. Mounting:

   • Ensure correct orientation during mounting to avoid damage.
   • Follow manufacturer guidelines for soldering temperature and time.

3. Operating Conditions:

   • Do not exceed the maximum ratings listed in the table to prevent device failure.
   • Operate within the specified temperature range to ensure reliability.

4. Testing:

   • Before integrating into a circuit, verify parameters such as RDS(on) and VGS(th) using appropriate test equipment.

5. Applications:

   • Suitable for use in low-power applications requiring efficient switching.
   • Ideal for battery-operated devices due to its low on-resistance.

(For reference only)